Accumulation and Analysis of Cuprous Ions in a Copper Sulfate Plating Solution

Scientific Article | Ici, l’accumulation des ions cuivreux dans une solution en une expérience de modèle et d’une analyse fondée sur des mesures
Knowledge of the behavior of cuprous ions (monovalent copper ion: Cu(I)) in a copper sulfate plating bath is important for improving the plating process.

Techniques for Copper Plating with Copper Sulfate Solution

Copper - Wikipedia

IJERPH, Free Full-Text

CN101922027B - Cyanide-free alkaline copper plating solution and preparation method thereof - Google Patents

PDF) Spectroscopic and Electrochemical Analysis of Cu(I) in Electroplating Solution and Evaluation of Plated Films

Metals, Free Full-Text

Study the impact of CuSO4 and H2SO4 concentrations on lateral growth of hydrogen evolution assisted copper electroplating

Reduction of Cu(I) concentration on the air bubbling time. Absorbance

Copper Electroplating: How It Works and Its Applications

1-(4-Hydroxyphenyl)-2 H -tetrazole-5-thione as a leveler for acid copper electroplating of microvia - RSC Advances (RSC Publishing) DOI:10.1039/D2RA02274E